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| 畢業學年度 | 論文標題 | 連結 | 學位 | 畢業時長(years) |
|---|---|---|---|---|
| 關鍵字 | ||||
| 113 | 奈米雙晶銅... 奈米雙晶銅銀薄膜低溫直接接合之電遷移研究 (Electromigration behavior of nano-twinned Cu-Ag alloy thin films after low temperature direct bonding) | NTHU NDLTD | 碩 | 2.22 |
電遷移(Electromigration)、熱壓接合(metal direct bonding)、奈米雙晶(Nano-twin)、銅銀(silver) 電遷移(E... | ||||
| 113 | 奈米雙晶銀... 奈米雙晶銀與二氧化矽應用於異質材料整合之低真空環境接合研究 (Low vacuum bonding using nano-twinned silver and SiO2 for heterogeneous integration) | NTHU NDLTD | 碩 | 2.15 |
異質整合(nano-twinned silver)、奈米雙晶銀(heterogeneous integration)、二氧化矽(advanced packaging)、先進封裝(SiO2)、混合接合(hybrid bond) 異質整合(... | ||||
| 113 | 濺鍍奈米雙... 濺鍍奈米雙晶結構Al9SiCo20Cr20Ni45NbMo4中熵合金薄膜在乾空氣中之高溫氧化行為研究 (High-Temperature Oxidation Behavior of Sputtered Nanotwinned Al9SiCo20Cr20Ni45NbMo4 Medium-Entropy Alloy Thin Films in Dry Air) | NTHU NDLTD | 碩 | 2.02 |
中熵合金(Medium-Entropy Alloy)、高溫氧化(Oxidation behavior)、奈米雙晶結構(Nanotwin) 中熵合金(... | ||||
| 113 | 溫度梯度對... 溫度梯度對固態銅銦銅結構中介金屬化合物成長之影響 (The Impact of Temperature Gradient on the Growth of Intermetallic Compounds in Solid Cu-In-Cu Structures) | NTHU NDLTD | 碩(提早入學) | 2.06 |
熱遷移(thermomigration)、三維立體封裝(temperature gradient)、無鉛銲錫(lead-free solder) 熱遷移(t... | ||||
| 112 | 共濺鍍奈米... 共濺鍍奈米晶銅銀合金薄膜熱穩定性研究 (Thermal stability of sputtered nanocrystalline CuAg alloy thin films) | NTHU NDLTD | 碩 | 2.00 |
爐管退火(Furnace annealing)、退火(Annealing)、銅銀合金(Cu-Ag alloy)、奈米多晶薄膜(Nanocrystalline thin films)、相分離(Phase separation)、真空度(Vacuum level) 爐管退火(... | ||||
| 112 | 磁控濺鍍之... 磁控濺鍍之基板溫度對於高熵合金薄膜微結構與性質影響 (Effect of substrate temperature on properties and microstructure of high entropy alloy thin films deposited by magnetron sputtering systems) | NTHU NDLTD | 碩 | 2.08 |
高熵合金(High entropy alloy)、濺鍍(Sputter)、薄膜(Thin films)、微結構(Microstructure)、基板溫度(Substrate temperature)、機械性質(Mechanical property) 高熵合金(... | ||||
| 111 | 雷射退火對... 雷射退火對於高(111)優選晶向奈米雙晶銀之微結構與性質影響 (Study of Laser Annealing on Microstructure and Properties of Nano-twinned Silver with Highly (111) Preferred Orientation) | NTHU NDLTD | 碩 | 2.00 |
雷射退火(Laser annealing)、退火(Annealing)、奈米雙晶薄膜(Nanotwin thin film)、銀(Silver)、晶粒成長(Grain growth)、異常晶粒成長(Abnormal grain growth) 雷射退火(... | ||||
| 111 | 奈米雙晶銅... 奈米雙晶銅銀合金電遷移行為之探討 (Improvement of the electromigration resistance by introducing the silver nano-twinned structure with copper dopping effect) | NTHU NDLTD | 碩 | 2.00 |
銅銀合金(Cu-Ag alloy)、奈米雙晶(Nano-twinned)、電遷移(Electromigration) 銅銀合金(... | ||||
| 111 | 應用高(1... 應用高(111)優選晶向奈米雙晶銀於異質材料整合之低溫大氣直接接合研究 (Low-Temperature Atmospheric Direct Bonding using Nano-twinned Silver with Highly (111) Preferred Orientation for Heterogeneous integration) | NTHU NDLTD | 碩 | 2.13 |
奈米雙晶銀(Nano-twinned Ag)、先進封裝(Advanced packaging)、異質整合(Heterogeneous integration)、直接接合(Direct bonding) 奈米雙晶銀... | ||||
| 111 | 共濺鍍奈米... 共濺鍍奈米雙晶銅銀合金薄膜之微結構、性質與低溫直接接合應用探討 (Investigation of microstructure, properties and low-temperature direct bonding application of co-sputtering nano-twinned Cu-Ag alloy thin films) | NTHU NDLTD | 碩 | 2.13 |
共濺鍍(Co-sputtering)、接合(Bonding)、銅銀合金(Cu-Ag)、奈米雙晶(Nanotwins)、薄膜(Films) 共濺鍍(C... | ||||
| 111 | 以電漿輔助... 以電漿輔助化學氣相沉積法生長高品質鍺錫薄膜用以製作光偵測器 (High Quality Germanium Tin Thin Film by PECVD Suitable for Fabricating Photodetector) | NTHU NDLTD | 碩 | 2.07 |
鍺錫薄膜(germanium-tin thin film)、薄膜沉積(thin film deposition)、雷射退火(laser annealing)、電漿輔助化學氣相沉積法(plasma-enhanced chemical vapor deposition) 鍺錫薄膜(... | ||||
| 111 | 高熵合金及... 高熵合金及其氮化物薄膜之製程、 微結構及性質探討 (The Process, Microstructure, and Properties of High Entropy Alloys and Nitride Thin films) | NTHU NDLTD | 碩逕博(提早入學) | 5.40 |
高熵合金(High entropy alloy)、高熵氮化物(High entropy Nitride)、薄膜(Thin film)、抗高溫氧化(High temperature anti-oxidation)、奈米壓痕(Nanoindentation) 高熵合金(... | ||||
| 110 | 利用磁控共... 利用磁控共濺鍍以及第一原理模擬計算探討銀銅合金薄膜性質與微結構 (Investigation on the Properties and Microstructures of Ag-Cu Alloy Thin Films by Magnetron Co-sputtering and First-principles Calculations) | NTHU NDLTD | 碩 | 1.99 |
磁控共濺鍍(Magnetron co-sputtering)、第一原理模擬計算(First-principles calculations)、銀銅合金(Ag-Cu alloy)、薄膜(Thin film)、奈米雙晶(Nanotwin)、疊差能(Stacking fault energy) 磁控共濺鍍... | ||||
| 110 | 濺鍍奈米雙... 濺鍍奈米雙晶結構鈷鉻鐵鎳中熵合金薄膜熱穩定性研究 (Thermal stability of sputtered nanotwinned CoCrFeNi medium entropy alloy thin films) | NTHU NDLTD | 碩 | 1.99 |
高熵合金(High entropy alloys)、薄膜材料(Thin film)、奈米雙晶(Nanotwins)、熱穩定性(Thermal stability) 高熵合金(... | ||||
| 110 | 添加金屬於... 添加金屬於FLiNaK熔鹽中對材料的腐蝕影響 (Effect of Metallic Addition on Corrosion Mitigation of Materials in Molten LiF-NaF-KF) | NTHU NDLTD | 碩 | 1.97 |
熔鹽(Molten-salt)、鎳基超合金(Nickel-base superalloy)、腐蝕(Corrosion) 熔鹽(Mo... | ||||
| 109 | 碲化鍺熱電... 碲化鍺熱電塊材與銅電極間低溫大氣接合技術研究 (Development of Low Temperature Ag-to-Ag direct bonding technology for GeTe Thermoelectric Bulk and Cu Electrode in Atmosphere) | NTHU NDLTD | 碩 | 2.24 |
GeTe 熱電材料(GeTe thermoelectric materials)、接合(bonding)、銀薄膜(silver thin film)、低溫(low-temperature)、大氣環境(atmosphere)、濺鍍製程(Sputter) GeTe ... | ||||
| 109 | 高（111... 高（111）優選方向奈米雙晶銀與無優選方向細晶粒銀在低溫大氣環境中的直接接合研究 (Low Temperature Ag-to-Ag Direct Bonding in Atmosphere on Highly (111) Oriented Nanotwinned Silver and Random Oriented Fine-grain Silver) | NTHU NDLTD | 碩 | 2.13 |
奈米雙晶(Nanotwin)、接合(bonding)、銀薄膜(silver thin film)、低溫(Ag)、大氣環境(low-temperature)、濺鍍製程(atmosphere) 奈米雙晶(... | ||||
| 109 | 奈米雙晶銀... 奈米雙晶銀導線之電遷移行為研究 (Electromigration Behavior of Nanotwinned Ag Interconnects) | NTHU NDLTD | 碩 | 2.11 |
電遷移(Electromigration)、雙晶薄膜(Nanotwinned thin film)、導線材料(Interconnect material)、濺鍍製程(Sputtering process) 電遷移(E... | ||||
| 109 | (111)... (111)優選晶向奈米雙晶銀薄膜之微結構與性質及應用之研究 (The microstructure, properties and application of highly (111)-oriented nanotwinned Ag films) | NTHU NDLTD | 碩逕博 | 6.11 |
奈米雙晶(Nanotwin)、銀薄膜(Silver film)、濺鍍(Sputter)、直接接合(Direct bonding) 奈米雙晶(... | ||||
| 109 | 田口法探討... 田口法探討濺鍍因子對鈷鉻鐵鎳中熵合金薄膜微結構及性質影響 (Optimization of CoCrFeNi thin film sputtering process by Taguchi method) | NTHU NDLTD | 碩 | 2.07 |
田口法(Taguchi method)、中熵合金(medium entropy alloy)、鈷鉻鐵鎳(CoCrFeNi)、濺鍍(sputter) 田口法(T... | ||||
| 109 | 中熵合金N... 中熵合金Ni37Co37Cr14Al6TixTa6-x在高溫下之相穩定研究 (Phase Stability in Middle Entropy Alloy Ni37Co37Cr14Al6TixTa6-x at High Temperature) | NTHU NDLTD | 碩 | 2.49 |
中熵合金(Middle entropy alloy)、鎳基合金(Ni-based alloy)、相穩定(Phase stability)、時效(aging) 中熵合金(... | ||||
| 109 | 細小鋁打線... 細小鋁打線在退火製程下的微結構變化探討 (Study on Microstructural Evolution of Aluminum Bonding Wire under Annealing Process) | NTHU NDLTD | 碩 | 5.45 |
鋁打線(Aluminum Wire Bonding)、異常晶粒成長(Abnormal Grain Growth)、微結構(Microstructure) 鋁打線(A... | ||||
| 109 | 高＜111... 高＜111＞優選方向奈米雙晶銀薄膜熱穩定性研究 (Study on thermal stability of highly ＜111＞-oriented nanotwinned silver thin films) | NTHU NDLTD | 碩 | 2.05 |
奈米雙晶(Nanotwinned)、銀薄膜(Silver thin films)、濺鍍(Sputtering)、熱穩定性(Thermal stability)、微結構變化(Microstructural evolution)、退火雙晶(Annealing twins)、異常晶粒成長(Abnormal grain growth) 奈米雙晶(... | ||||
| 109 | 磁控濺鍍之... 磁控濺鍍之基板偏壓對於雙晶銅薄膜微結構與性質影響 (Effect of substrate bias on properties and microstructure of nanotwinned Copper thin films deposited by magnetron sputtering systems) | NTHU NDLTD | 碩 | 2.05 |
雙晶(nanotwin)、銅(Cu)、濺鍍(Sputtered)、薄膜(bias)、奈米雙晶(twin)、偏壓(film) 雙晶(na... | ||||
| 109 | 2.5D立... 2.5D立體封裝中微型接點由表面擴散造成的熱遷移與電遷移破壞機制 (Thermomigration and electromigration induced by surface diffusion of Sn on Ni/Cu metallization in microbumps for 2.5-dimensional integrated circuits packaging) | NTHU NDLTD | 碩 | 2.05 |
2.5D立體封裝(2.5D-IC)、微接點(micro bumps)、可靠度(reliability)、熱遷移(thermomigration)、電遷移(electromigration)、表面擴散(surface diffusion) 2.5D立... | ||||
| 108 | 高熵合金A... 高熵合金Al4Co3Cr25Cu10Fe25Ni33在含氧氣氛下的高溫氧化行為 (High temperature oxidation behavior of high entropy alloy Al4Co3Cr25Cu10Fe25Ni33 in oxygen-containing atmospheres) | NTHU NDLTD | 碩(提早入學) | 1.77 |
高熵合金(high entropy alloy)、高溫氧化(high temperature oxidation)、腐蝕(corrosion)、鎳基合金(nickel-base alloy)、超高溫氣冷反應器(VHTR)、氧化層(TGA)、熱重分析儀(alloy 800H)、合金800H(alloy 617)、合金617(undefined) 高熵合金(... | ||||
| 107 | 低溫接合製... 低溫接合製程中奈米銀膠的微結構變化及可靠度測試 (Microstructure and Reliability of Silver Nanoparticles Paste for Low-Temperature Bonding Process) | NTHU NDLTD | 碩 | 2.00 |
奈米銀膠(Ag nanoparticles paste)、低溫接合(low temperature bonding process) 奈米銀膠(... | ||||
| 107 | 溫度梯度對... 溫度梯度對銅/銦/銅對稱結構中介金屬化合物成長及微結構之影響 (Effect of temperature gradient on microstructure evolution and the growth of intermetallic compound in Cu/In/Cu symmetric structure) | NTHU NDLTD | 碩 | 1.99 |
熱遷移(Thermomigration)、介金屬化合物(IMC) 熱遷移(T... | ||||
| 107 | 高密度(1... 高密度(111)方向雙晶銅在金屬直接接合過程中的微結構變化 (Microstructural Evolution of High (111)-oriented Nanotwinned Copper During Direct Bonding Process) | NTHU NDLTD | 碩 | 1.98 |
雙晶銅(Nanotwinned Cu)、直接銅-銅接合技術(Direct Cu-Cu Bonding)、濺鍍製程(sputtering depostion)、應力驅動晶粒成長(Stress-induced grain growth) 雙晶銅(N... | ||||
| 107 | 發展傾轉載... 發展傾轉載台應用於桌上型掃描穿透式電子顯微鏡 (Development of Tilting Sample Holder Applied for Desktop Scanning Transmission Electron Microscope) | NTHU NDLTD | 碩 | 1.97 |
桌上型電子顯微鏡(Desktop Electron Microscope)、傾轉載台(Scanning Transmission Electron Microscope)、掃描穿透式電子顯微鏡(Tilting Sample Stage) 桌上型電子... | ||||
| 107 | 在鈷/錫銀... 在鈷/錫銀焊錫/銅非對稱結構中溫度梯度對界面介金屬化合物成長的影響 (Effect of temperature gradient on the growth of interfacial intermetallic compounds in Co/SnAg/Cu asymmetrical structure) | NTHU NDLTD | 碩 | 2.05 |
熱遷移(Thermomigration)、無鉛銲錫(Lead-free solder)、界面反應(Interfacial reactions)、介金屬化合物(Intermetallic compounds)、鈷/焊錫/銅非對稱結構(Co/SnAg/Cu asymmetrical structure)、擴散(Diffusion) 熱遷移(T... | ||||
| 107 | 退火實驗對... 退火實驗對奈米雙晶銅微凸塊微結構改變之研究 (Microstructural Evolution of Highly (111)-oriented Nanotwinned Copper Bump during Annealing Process) | NTHU NDLTD | 碩 | 2.05 |
濺鍍(sputter)、奈米雙晶銅(nanotwinned copper)、異向性晶粒成長(anisotropic grain growth) 濺鍍(sp... | ||||
| 106 | 印刷奈米銀... 印刷奈米銀導線之電遷移行為研究 (Electromigration Behavior of Screen-Printing Ag nanoparticles Interconnects) | NTHU NDLTD | 碩 | 1.97 |
電遷移(Electromigration)、網版印刷(Screen-Printing)、奈米銀(Ag)、導線(Nanoparticles) 電遷移(E... | ||||
| 106 | Al-Cu... Al-Cu 楔型打線在電遷移實驗下之破壞機制 (Failure Mechanism of Al-Cu Wedge-wedge Bonding under Electromigration Test) | NTHU NDLTD | 碩 | 2.08 |
Al打線(Al wire bonding)、電遷移(electromigration)、高功率模組(power modules)、介金屬化合物(IMC) Al打線(... | ||||
| 106 | 鍍著氮化鉻... 鍍著氮化鉻鋯-4合金與裸材於850℃不同氣氛下高溫氧化行為之比較 (Comparison of Oxidation Behavior of CrNx-coated and Bare Zircaloy-4 Cladding Material under Different Oxidative Atmospheres at 850℃) | NTHU NDLTD | 碩 | 2.08 |
氮化鉻(coating)、燃料護套(cladding material)、高溫氧化(oxidation)、鋯-4(Zr-4) 氮化鉻(c... | ||||
| 106 | 在鈷/錫銀... 在鈷/錫銀/鈷對稱結構中熱遷移對焊錫微結構及介金屬化合物成長的影響 (Microstructure evolution and interfacial growth of intermetallic compound for Co/SnAg/Co structure under thermomigration) | NTHU NDLTD | 碩 | 2.07 |
熱遷移(Diffusion)、無鉛銲錫(Thermomigration)、CoSn3介金屬化合物(CoSn3 intermetallic compound)、溫度梯度(Temperature gradient)、擴散(Pb-free solder) 熱遷移(D... | ||||
| 104 | 鍍著氮化鉻... 鍍著氮化鉻之鋯四合金護套材料在高溫水氣環境中的氧化行為 (The Oxidation Behavior of CrN-coated Zircaloy-4 Cladding Material under High-temperature Steam Environment) | NTHU NDLTD | 碩 | 暫無口試日期 |
氮化鉻薄膜(CrN thin film)、氧化(oxidation)、鋯合金(Zircaloy)、燃料護套(fuel cladding) 氮化鉻薄膜... | ||||
| 104 | 退火過程中... 退火過程中介層對於奈米雙晶銅薄膜之異常晶粒成長的影響 (The Effect of Interlayer on Abnormal Grain Growth of Nanotwinned Copper Thin Film during Annealing Process) | NTHU NDLTD | 碩 | 暫無口試日期 |
銅(copper)、雙晶(twin)、薄膜(thin film)、異常晶粒成長(abnormal grain growth) 銅(cop... | ||||
| 104 | 藉由Ag3... 藉由Ag3Sn介層有效抑制無鉛焊錫中熱遷移所導致的銅原子流量之研究 (The effective suppression of thermomigration-induced Cu flux in lead free solder joints by Ag3Sn interlayer) | NTHU NDLTD | 碩 | 暫無口試日期 |
銀三錫(Ag3Sn)、熱遷移(thermomigration)、無鉛焊錫(lead free solder)、介金屬化合物(intermetallic compound)、銅原子流量(Cu flux) 銀三錫(A... | ||||
| 104 | 鈷與無鉛S... 鈷與無鉛Sn-3.5Ag銲錫固態介面反應分析 (The interfacial reaction of Co/Solid-state Sn-3.5Ag Pb-free solder.) | NTHU NDLTD | 碩 | 暫無口試日期 |
固態介面反應(Solid-state interfacial reaction)、無鉛銲錫(lead-free solder)、鈷錫系統(Co-Sn) 固態介面反... | ||||
| 104 | 銀鈀合金打... 銀鈀合金打線經高溫儲存及溫度循環測試下在腐蝕環境中的可靠度及破壞模式之研究 (Failure Mechanism and Reliability of Ag-4Pd alloy wire bonded on Al-Si metallization under High Temperature Storage and Thermal Cycle tests in Corrosive Environments) | NTHU NDLTD | 碩 | 暫無口試日期 |
打線接合(wire bonding)、銀合金打線(silver alloy wire)、介金屬化合物(intermetallic compounds)、腐蝕(corrosion)、高溫儲存(high temperature storage)、溫度循環(thermal cycle) 打線接合(... | ||||
| 104 | 細間距印刷... 細間距印刷電子奈米銀導線電化學遷移及其抗性提升之研究 (Electrochemical migration behavior and its improvement of printed fine-pitch Ag interconnects) | NTHU NDLTD | 碩 | 暫無口試日期 |
電化學遷移(electrochemical migration)、恆溫恆濕測試(THB test)、滴水測試(water drop test)、自組裝單分子層(self assembly monolayer) 電化學遷移... | ||||
| 103 | 在鎳/錫銀... 在鎳/錫銀焊錫/鎳對稱結構中熱遷移對鎳錫介金屬化合物界面反應之影響 (Interfacial reactions of Ni3Sn4 intermetallic compound in Ni/SnAg/Ni structure under thermomigration) | NTHU NDLTD | 碩 | 暫無口試日期 |
熱遷移(thermomigration)、鎳(Ni)、焊錫(solder)、界面反應(Interfacial reaction)、溫度梯度(temperature gradient)、介金屬化合物(Ni3Sn4) 熱遷移(t... | ||||
| 103 | 全光域釕金... 全光域釕金屬光敏染料合成及探討其在染敏太陽能電池的應用 (Synthesis of Panchromatic Ru(II) Sensitizers and Fabrication of Dye-Sensitized Solar Cells) | NTHU NDLTD | 碩 | 暫無口試日期 |
染敏太陽能電池(dye-sensitized solar cell)、釕金屬錯合物(ruthenium complex) 染敏太陽能... | ||||
| 103 | 發光二極體... 發光二極體模組中銀鈀合金打線在電遷移實驗下的微結構及形貌之研究 (Microstructure evolution of Ag-4Pd alloy wire bonded on Al-Si metallization under Electromigration test in light-emitting diode (LED) modules) | NTHU NDLTD | 碩(提早入學) | 暫無口試日期 |
銀合金打線(Ag-alloyed wire bond)、電遷移(electromigration) 銀合金打線... | ||||
| 102 | 非平衡磁控... 非平衡磁控濺鍍氮化鈦奈米晶薄膜以提升染料敏化太陽能電池效率與長效性 (Enhanced performance and long-term stability of dye-sensitized solar cells by sputtered TiN thin films) | NTHU NDLTD | 碩 | 暫無口試日期 |
染料敏化太陽能電池(dye-sensitized solar cells)、不鏽鋼(stainless steel)、長效性(long-term stability)、氮化鈦(titanium nitride) 染料敏化太... | ||||
| 102 | 使用銅錫複... 使用銅錫複合結構提升無鉛銲錫電遷移抗性之研究 (Enhanced electromigration resistance of Pb-free solders by using Cu/Sn composite structure) | NTHU NDLTD | 碩 | 暫無口試日期 |
電遷移(electromigration)、結構(structure)、無鉛銲錫(Pb-free solder) 電遷移(e... | ||||
| 102 | 在溫度梯度... 在溫度梯度環境中錫之非等向性對銅原子擴散的影響 (Effects of anisotropic Beta-Sn alloys on Cu diffusion under a temperature gradient) | NTHU NDLTD | 碩 | 暫無口試日期 |
無鉛銲錫(Pb-free solder)、熱遷移(Thermomigration)、非等向性(Anisotropy)、擴散(Diffusion)、合金(Intermetallics)、介金屬化合物(Package)、電子封裝(undefined) 無鉛銲錫(... | ||||
| 102 | 在液態及固... 在液態及固態無鉛銲錫中溫度梯度對Ag3Sn介金屬化合物成長的影響 (Effect of temperature gradient on the growth of Ag3Sn intermetallic compounds in Pb-free solder during liquid-state and solid state aging process) | NTHU NDLTD | 碩 | 暫無口試日期 |
熱遷移(thermomigration)、銲錫(solder)、銀(temperature gradient)、介金屬化合物(intermetallic compounds)、溫度梯度(silver) 熱遷移(t... | ||||
| 102 | 在電遷移環... 在電遷移環境中銲錫高度對無鉛銲錫孔洞生成及介金屬化合物溶解的影響 (Effect of joint thickness on void formation and intermetallic compound dissolution for Pb-free solders during electromigration) | NTHU NDLTD | 碩 | 暫無口試日期 |
無鉛銲錫(Pb-free solder)、電遷移(electromigration)、固態擴散(diffuision)、介金屬化合物(intermetallic compound)、電子封裝(packages) 無鉛銲錫(... | ||||
| 101 | 非平衡磁控... 非平衡磁控濺鍍系統鍍著之奈米雙晶銅薄膜其微結構與性質之研究 (The Microstructure and Properties of Nanotwinned Cu Thin Films Deposited by Unbalanced Magnetron Sputtering System) | NTHU NDLTD | 碩 | 暫無口試日期 |
奈米雙晶銅、非平衡磁控濺鍍 奈米雙晶銅... | ||||
| 101 | 環境溫度對... 環境溫度對於覆晶封裝中錫鉛焊錫熱遷移之影響 (Effect of temperature on thermomigration of composite 95%Pb5%Sn-eutectic SnPb solder joints in flip chip technology) | NTHU NDLTD | 碩 | 暫無口試日期 |
熱遷移 熱遷移... | ||||
| 101 | 絕緣閘雙極... 絕緣閘雙極性電晶體模組中之銅-鋁楔型打線在電遷移實驗下之破壞機制 (Failure mechanisms of Cu-Al wedge bonding under electromigration test in insulated-gate bipolar transistor (IGBT) modules) | NTHU NDLTD | 碩 | 暫無口試日期 |
銅打線(wire bond)、電遷移(electromigration) 銅打線(w... |