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| 畢業學年度 | 論文標題 | 連結 | 學位 | 畢業時長(years) |
|---|---|---|---|---|
| 關鍵字 | ||||
| 112 | 以二維及三... 以二維及三維有限元素模擬法搭配網格控制預估晶圓級封裝之可靠度 (Estimation of Reliability in Wafer-Level Packaging Using Two-Dimensional and Three-Dimensional Finite Element Simulation Methods with Mesh Size Control) | NTHU | 碩 | 無口試日期 |
晶圓級封裝(Wafer-Level Package)、有限元素法(finite element method)、加速熱循環測試(Accelerated Thermal Cycling Test)、Coffin Manson應變法(Coffin Manson empirical equation)、網格尺寸控制(mesh size control) 晶圓級封裝... | ||||
| 112 | 使用黏彈性... 使用黏彈性模型搭配製程模擬法探討面板級扇出型封裝翹曲與層間應力研究 (Study on Warpage and Interfacial Stress behavior of Fan-Out Panel-Level Package Using Viscoelastic Model and Process Modeling Technology) | NTHU | 碩 | 無口試日期 |
面板級扇出型封裝(Fan-Out Panel-Level Packaging)、壓模成型製程(Compression Molding)、後熟化製程(Post Mold Cure)、剝離載板製程(Debonding)、熱膨脹係數不匹配(CTE Mismatch)、有限元素法(Finite Element Method)、製程模擬法(Process Modeling Technology)、翹曲(Warpage)、層間應力(Interfacial Stress)、彈性模型(Elastic Model)、黏彈性模型(Viscoelastic Model)、人工智慧輔助模擬設計(AI-assisted Design on Simulation)、人工神經網絡(Artificial Neural Network) 面板級扇出... | ||||
| 112 | 以晶圓級封... 以晶圓級封裝為案例探討縮減人工神經網路最佳參數搜尋時間之方法 (Using Wafer-Level Packaging as a Case Study of Reducing Artificial Neural Network Hyperparameter Searching Time) | NTHU | 碩 | 無口試日期 |
晶圓級封裝(Wafer Level Packaging)、有限元素分析(Finite Element Analysis)、溫度循環測試(Temperature Cycling test)、可靠度預估(Reliability Prediction)、Chaboche模型(Chaboche Model)、機器學習(Machine Learning)、人工神經網路(Artificial Neural Network)、曲線擬合(Artificial Neural Network)、網格搜索法(Curve fitting)、平行運算(Grid Search) 晶圓級封裝... | ||||
| 112 | 等效理論與... 等效理論與全域—局部有限元素法應用於封裝全模型應力分析之適用性研究 (Applicability Investigation of Equivalent Theory and Global-Local Finite Element Method in Stress Analysis of Full Model Package) | NTHU NDLTD | 碩 | 2.15 |
等效理論(Equivalent Technique)、全域—局部有限元素法(Global-Local Finite Element Method)、多點約束有限元素法(Multi-Point Constraints)、球柵陣列封裝(Ball Grid Array Package)、熱應力分析(Thermal Stress Analysis) 等效理論(... | ||||
| 112 | 以全域－局... 以全域－局部有限單元模擬分析PBGA基板於bias-HAST測試下的熱電耦合效應 (Analysis the Thermal-Electro Coupling Effect in PBGA Substrate Trace During the bias-HAST Testing by Using Global-Local Finite Element Method) | NTHU NDLTD | 碩 | 2.14 |
車用電子元件(automotive electronic components)、印刷電路板(printed circuit boards)、可靠度測試(reliability testing)、電遷移(electromigration)、有限元素法(finite element method)、多物理場(multiphysics)、電熱耦合分析(coupled electrothermal analysis) 車用電子元... | ||||
| 111 | 使用製程模... 使用製程模擬法分析幾何和材料不確定性對面板級扇出型封裝之翹曲影響 (Studying the Warpage Effect Caused by Geometry and Material Uncertainty in FO-PLP) | NTHU NDLTD | 碩 | 1.92 |
面板級扇出型封裝(Fan-Out Panel Level Packaging)、壓模成型(Compression Molding)、後熟化製程(Post Mold Cure)、剝離製程(Debonding Process)、熱膨脹係數不匹配(CTE Mismatch)、有限元素法(Finite Element Method)、製程模擬法(Process Modeling Technology)、非對稱翹曲(Asymmetric Warpage)、機器學習(Machine Learning)、人工神經網路(Artificial Neural Network) 面板級扇出... | ||||
| 111 | 以製程模擬... 以製程模擬與黏彈理論探討面板級扇出型封裝之非對稱翹曲幾何研究 (Studying Asymmetric Warpage Behavior of Panel-Level Packages Using Process Modeling Techniques and Viscoelasticity Theory) | NTHU NDLTD | 碩 | 1.92 |
扇出型面板級封裝(Fan-Out Panel Level Package)、有限元素法(Finite Element Method)、黏彈性 本構模型(Viscoelastic Model)、封膠環氧樹脂熱壓成型製程(CTE mismatch)、熱膨脹係數不匹配(Asymmetric Warpage)、K-近 鄰演算法(K-nearest neighbors (KNN)) 扇出型面板... | ||||
| 111 | 以網格搜索... 以網格搜索法與平行運算提升晶圓級封裝可靠度預估之AI訓練效率研究 (Using Grid Search Methods and Parallel Computing to Reduce AI Training Time for Reliability Lifetime Prediction of Wafer-Level Packaging) | NTHU NDLTD | 碩 | 1.92 |
晶圓級封裝(Wafer Level Packaging)、有限單元分析(Finite Element Analysis)、熱循環負載(Thermal Cycle Load)、可靠度預估(Reliability Estimation)、機器學習(Machine Learning)、平行運算(Parallel Computing)、網格搜索法(Grid Search) 晶圓級封裝... | ||||
| 111 | 以模擬設計... 以模擬設計法進行異質整合小晶片封裝設計與可靠度研究 (Study on Design and Reliability Assessment of Heterogeneous Chiplets Packaging Using Design-on-Simulation Technology) | NTHU NDLTD | 博 | 5.70 |
加速熱循環(Accelerated Thermal Cycling(ATC))、有限單元法(Finite Element Method(FEM))、小晶片(Chiplets, Heterogeneous Integration(HI))、異質整合(Coffin-Manson)、疲勞(Life prediction)、壽命預估(thermal management)、熱管理(Ellison’s equation)、模擬設計法(Design-on-Simulation Technology) 加速熱循環... | ||||
| 111 | 應用人工智... 應用人工智慧輔助設計於晶圓級封裝之可靠度壽命預測研究 (Study on AI-Assisted Design-On-Simulation Technology for Reliability Life Prediction of Wafer Level Package) | NTHU NDLTD | 博 | 5.08 |
回歸模型(KNN)、有限元模擬(FEM simulation)、人工智能(Machine learning)、機器學習(Regression model) 回歸模型(... | ||||
| 110 | 面板級封裝... 面板級封裝非對稱翹曲研究及使用極限隨機樹演算法預測翹曲幾何 (Investigation of the Asymmetric Warpage of Panel-Level Package and Using Extra Trees Algorithm to Predict the Warpage Geometry) | NTHU NDLTD | 碩 | 1.95 |
機器學習(Machine Learning)、扇出型面板級封裝(Fan-Out Panel Level Package)、有限單元法(Finite Element Method)、熱固性材料(Thermosetting Material)、非對稱翹曲(Asymmetric Warpage)、熱膨脹係數不匹配(CTE mismatch)、極度隨機樹(Extremely Randomized Trees)、模壓成型(Compression Molding) 機器學習(... | ||||
| 110 | 多項式迴歸... 多項式迴歸結合聚類分析對晶圓級封裝之預估可靠度壽命研究 (Study on Prediction Reliability Life of Wafer Level Packaging Using Polynomial Regression with Cluster Analysis) | NTHU NDLTD | 碩 | 1.93 |
晶圓級封裝(Wafer Level Package)、有限元素方法(Finite Element Method)、熱循環負載(Thermal Cycling Test)、可靠度(Reliability)、機器學習(Machine Learning)、多項式迴歸(Polynomial Regression)、聚類分析(Cluster analysis) 晶圓級封裝... | ||||
| 110 | 使用KNN... 使用KNN結合聚類分析對晶圓級封裝之可靠度預估研究 (Predict the Reliability Life of Wafer Level Packaging using K-Nearest Neighbors algorithm with Cluster Analysis) | NTHU NDLTD | 碩 | 1.93 |
晶圓級晶片尺寸封裝(Wafer Level Package)、有限單元分析(Finite Element Analysis)、熱循環負載(Thermal Cycling Test)、可靠度預估(Reliability Assessment)、人工智慧(Artificial Intelligence)、監督式學習(Supervised Learning)、非監督式學習(Unsupervised Learning)、K-鄰近演算(K-Nearest Neighbors)、集群分析(K-means) 晶圓級晶片... | ||||
| 110 | 高斯過程迴... 高斯過程迴歸模型結合聚類分析對預估晶圓級封裝之影響研究 (Predict Reliability Life of Wafer Level Packaging Using GPR with Cluster Analysis) | NTHU NDLTD | 碩 | 1.93 |
晶圓級封裝(Wafer level packaging)、有限單元分析(Finite Element Analysis)、熱循環負載(Thermal Cycle Load)、可靠度預估(Gaussian Regression Process)、機器學習(Machine Learning)、高斯迴歸過程(Reliability Estimation) 晶圓級封裝... | ||||
| 110 | 數據分布於... 數據分布於核嶺回歸模型對晶圓級封裝之可靠度預估研究 (Research on The Effect of Data Distribution in Kernel Ridge Regression Model on WLP Reliability Life Cycle Prediction) | NTHU NDLTD | 碩(外籍生) | 2.59 |
有限單元法(Finite Element Method)、晶圓級晶片尺寸封裝(Wafer Level Chip Scale Package)、機器學習(Machine Learning)、核嶺回歸演算法(Kernel Ridge Regression)、聚類演算法(Cluster Analysis) 有限單元法... | ||||
| 109 | 數據分布於... 數據分布於集成學習演算法對晶圓級封裝可靠度預估之影響 (The effect of data distribution in Ensemble Learning Algorithms on WLCSP Reliability Prediction) | NTHU NDLTD | 碩 | 1.97 |
有限元素分析(Finite Element Analysis)、晶圓級晶片尺寸封裝(Wafer Level Chip Size Packaging)、隨機森林(Random Forest)、極度隨機樹(Extremely Randomized Trees)、自適應增強(Adaptive Boosting)、梯度增強(Gradient Boosting) 有限元素分... | ||||
| 109 | 數據及不同... 數據及不同結構之循環神經網路對預估晶圓級封裝焊點可靠度影響研究 (Data and Structure Effect of RNN Model on Solder Joint Reliability Prediction of Wafer Level Packages) | NTHU NDLTD | 碩 | 1.97 |
晶圓級封裝(Wafer Level Package)、有限單元分析(Finite Element Analysis)、熱循環負載(Thermal Cycling Test)、可靠度預估(Reliability Assessment)、機器學習(Machine Learning)、循環神經網路(Recurrent Neural Network) 晶圓級封裝... | ||||
| 109 | 數據效應對... 數據效應對支援向量迴歸模型於晶圓級封裝之可靠度預估研究 (Study on the Data Effect on Support Vector Regression Model for Wafer Level Package Reliability Prediction) | NTHU NDLTD | 碩 | 1.97 |
晶圓級封裝(Wafer Level Package)、有限單元分析(Finite Element Analysis)、熱循環負載測試(Thermal Cycling Test)、可靠度分析(Reliability Analysis)、機器學習(Machine Learning)、支援向量迴歸(Support Vector Regression) 晶圓級封裝... | ||||
| 109 | 以粒子群最... 以粒子群最佳化法決定神經網路之初始權重於預估面板級封裝之翹曲研究 (Using PSO to Generate Initial Weight of Neural Network to Predict the Warpage of Panel-Level Package) | NTHU NDLTD | 碩 | 1.97 |
卷積神經網路(Convolution Neural Network)、機器學習(Machine Learning)、扇出型面板級封裝(Fan-Out Panel Level Package)、等效熱膨脹係數法(Equivalent CTE)、有限單元法(Finite Element Method)、熱膨脹係數不匹配(CTE mismatch)、區域最低值(Local Minimum)、粒子群最佳化法(Particle Swarm Optimization) 卷積神經網... | ||||
| 109 | 扇出型玻璃... 扇出型玻璃基板封裝設計之失效壽命預估及驗證研究 (Research on Failure Life Prediction and Verification of Fan-Out Glass Substrate Package Design) | NTHU NDLTD | 博 | 8.21 |
晶圓級封裝(Fan-out package)、扇出型(glass substrate)、玻璃基板(strain)、應變(finite element)、有限單元法(design parameter)、3D模擬(simulation model) 晶圓級封裝... | ||||
| 108 | 數據分布於... 數據分布於隨機森林模型對晶圓級封裝之可靠度預估影響研究 (The Research of WLCSP Reliability Prediction with Data Distribution in Random Forest Regression Model) | NTHU NDLTD | 碩 | 1.92 |
晶圓級晶片尺寸封裝(Wafer Level Chip Scale Package)、有限單元法(Finite Element Method)、可靠度分析(Reliability Analysis)、機器學習(Machine Learning)、隨機森林(Random Forest) 晶圓級晶片... | ||||
| 108 | 多核心及新... 多核心及新型支援向量迴歸模型於晶圓級封裝可靠度預測之研究 (Research on Reliability Assessment of Wafer Level Package by using Multiple Kernel SVR and New Support Vector Regression) | NTHU NDLTD | 碩 | 1.92 |
晶圓級封裝(Wafer Level Package)、有限元素分析(Finite Element Analysis)、熱循環負載測試(Thermal Cycling Test)、可靠度分析(Reliability Analysis)、機器學習(Machine Learning)、支援向量回歸(Support Vector Regression) 晶圓級封裝... | ||||
| 108 | 不同數據於... 不同數據於循環神經網路模型對晶圓級封裝可靠度預估影響研究 (Research on the influence of Different Data applied to Recurrent Neural Network Regression Model for Wafer-Level Package Reliability Assessment) | NTHU NDLTD | 碩 | 1.92 |
晶圓級封裝(Wafer Level Package)、有限單元分析(Finite Element Analysis)、熱循環負載(Thermal Cycling Test)、可靠度預估(Reliability Assessment)、機器學習(Machine Learning)、人工神經網路(Artificial Neural Network)、循環神經網路(Recurrent Neural Network) 晶圓級封裝... | ||||
| 108 | 以修正型卷... 以修正型卷積神經網路法預估扇出型面板級封裝之翹曲研究 (Using Modified Convolutional Neural Network Method to Estimate the Warpage of the Fan-Out Panel Level Packaging) | NTHU NDLTD | 碩 | 1.92 |
卷積神經網路(Convolution Neural Network)、機器學習(Machine Learning)、邊緣檢測(Edge Detection)、扇出型面板級封裝(Fan-Out Panel Level Package)、等效熱膨脹係數法(Equivalent CTE)、有限單元法(FEM)(Finite Element Method(FEM))、熱膨脹係數不匹配(CTE mismatch)、熱固性材料(Thermosetting Material) 卷積神經網... | ||||
| 107 | 以循環神經... 以循環神經網路迴歸模型評估晶圓級封裝之可靠度 (Reliability Assessment of Wafer Level Package using Recurrent Neural Network Regression Model) | NTHU NDLTD | 碩 | 1.98 |
晶圓級封裝(Wafer Level Package)、有限單元分析(Finite Element Analysis)、加速熱循環測試(Accelerated Thermal Cycling Test)、可靠度預估(Reliability Assessment)、最佳網格尺寸(Optimal Mesh Size)、資料前處理(Artificial Intelligence)、人工智慧(Machine Learning)、機器學習(Data Preprocessing)、人工神經網路(Artificial Neural Network)、循環神經網路(Recurrent Neural Network)、長短期記憶(Long Short-Term Memory) 晶圓級封裝... | ||||
| 107 | 以支援向量... 以支援向量迴歸模型評估晶圓級封裝之可靠度 (Reliability Assessment of Wafer Level Package using Support Vector Regression Model) | NTHU NDLTD | 碩 | 1.98 |
晶圓級封裝(Wafer Level Package)、有限單元法(Finite Element Method)、熱循環測試(Thermal Cycling Test)、可靠度分析(Reliability Analysis)、機器學習(Machine Learning)、支援向量迴歸(Support Vector Regression) 晶圓級封裝... | ||||
| 107 | 以卷積神經... 以卷積神經網路模型預估扇出型面板級封裝之翹曲量研究 (Warpage Prediction of Fan-out Panel Level Packaging Using Convolution Neural Network Model) | NTHU NDLTD | 碩 | 1.98 |
扇出型面板級封裝(Fan-out Panel Level Packaging)、固化反應(Cure Reaction)、熱膨脹係數不匹配(CTE Mismatch)、等效熱膨脹係數(Warpage)、有限元素法(FEM)(Equivalent CTE)、機器學習(Finite Element Method)、神經網路(Machine Learning)、卷積神經網路(Neural Network)、邊緣檢測(Convolution Neural Network) 扇出型面板... | ||||
| 107 | 應用於微機... 應用於微機電元件高週疲勞預測之應力-壽命曲線研究分析 (Study on S-N Curve of High-Cycle Fatigue Prediction for MEMS Devices) | NTHU NDLTD | 博 | 4.79 |
微機電系統(Microelectromechanical Systems (MEMS))、有限單元法(Finite Element Method (FEM))、破裂(High cycle fatigue)、高周疲勞破壞(Electrostatic force)、電固耦合(Dynamic simulation)、吸附電壓(Silicon on Insulator (SOI))、動態模擬(Frequency effect)、絕緣層上覆矽(undefined)、彎曲(undefined)、扭轉(undefined)、頻率效應(undefined) 微機電系統... | ||||
| 107 | 以人工神經... 以人工神經網路回歸模型評估晶圓級封裝之可靠度 (Reliability Assessment of Wafer Level Package using Artificial Neural Network Regression Model) | NTHU NDLTD | 碩 | 2.46 |
晶圓級封裝(Wafer Level Package)、有限單元法(Finite Element Method)、熱循環測試(Thermal Cycling Test)、可靠度分析(Reliability Analysis)、網格適用尺寸(Optimal Mesh Size)、機器學習(Machine Learning)、回歸模型(Regression Model)、人工神經網路(Artificial Neural Network) 晶圓級封裝... | ||||
| 107 | 以隨機森林... 以隨機森林回歸模型評估晶圓級封裝之可靠度 (Reliability Assessment of Wafer-Level Packaging using Random Forest Regression Model) | NTHU NDLTD | 碩(提早入學) | 1.96 |
有限元素法(Finite Element Method)、晶圓級晶片尺寸封裝(Wafer Level Chip Size Packaging)、網格尺寸控制(Coffin-Manson’s model)、Coffin-Manson(Mesh Size Control Method)、機器學習(Machine Learning)、隨機森林演算法(Random Forest Algorithm) 有限元素法... | ||||
| 106 | 使用等效熱... 使用等效熱膨脹係數於扇出型面板級封裝之翹曲研究 (Warpage analysis of Fan-out panel level packaging using equivalent CTE) | NTHU NDLTD | 碩 | 1.97 |
面板級封裝(Panel level packaging)、環氧樹脂(Epoxy)、固化反應(cure reaction)、熱膨脹係數不匹配(CTE mismatch)、翹曲(Warpage)、等效熱膨脹係數(Equivalent CTE)、元素尺寸(Mesh size) 面板級封裝... | ||||
| 106 | 扇出型晶圓... 扇出型晶圓级晶片尺寸封裝之導線可靠度評估 (Trace line reliability assessment of FO-WLCSP) | NTHU NDLTD | 碩 | 1.97 |
扇出型封裝(fan-out package)、晶圓级封裝(wafer level package)、扇出型晶圓级晶片尺寸封裝(fan-out wafer level chip scale package)、有限單元法(finite element method)、可靠度評估(reliability analysis)、導線(trace line)、應力緩衝層(stress buffer layer)、熱循環測試(thermal cycling test)、脫層(delamination) 扇出型封裝... | ||||
| 106 | I/O墊片... I/O墊片尺寸對扇出型晶圓級封裝之可靠度影響評估 (Reliability Evaluation of I/O Pad Size Effect of FO-WLCSP) | NTHU NDLTD | 碩 | 1.97 |
扇出型封裝(Fan-Out Package)、晶圓級封裝(WLCSP)、有限單元法(Finite Element Method)、Coffin-Manson(Coffin-Manson)、加速溫度循環負載(Thermal Cycle Test(TCT))、可靠度預測(Chaboche dynamic hardening)、Chaboche動態硬化模型(Reliability) 扇出型封裝... | ||||
| 106 | 拉伸循環負... 拉伸循環負載下單晶矽微結構之高週疲勞特性研究 (Investigation of High Cycle Fatigue Characteristics of Monocrystalline Silicon Micro Structure Under Tensile Cyclic Loading) | NTHU NDLTD | 碩(外籍生) | 1.94 |
單晶矽薄膜(Single crystalline silicon thin film)、高週疲勞(High cycle fatigue)、壽命預估(Life prediction)、拉伸疲勞(Tensile fatigue)、有限單元法(Finite element method) 單晶矽薄膜... | ||||
| 106 | 彎矩循環負... 彎矩循環負載下矽質微結構高週波疲勞與頻率效應研究 (Investigation of High Cycle Fatigue and Frequency Effect of Silicon-Based Microstructures under Bending Cyclic Loading) | NTHU NDLTD | 碩 | 1.94 |
矽(Silicon)、微結構(Microstructure)、高週波疲勞(High cycle fatigue)、有限元素法(Finite element method)、頻率效應(Frequency effect) 矽(Sil... | ||||
| 105 | 受扭矩負載... 受扭矩負載下之矽質微結構高周疲勞特性研究 (Investigation of High Cycle Fatigue Characteristics of Silicon-based Micro Structure Under Torsion Loading) | NTHU NDLTD | 碩(外籍生) | 1.98 |
高周疲勞(High Cycle Fatigue)、微機電結構(MEMS)、扭矩負載(Torsion Loading)、第一主應力(First Principal Stress)、有限元素分析(Finite Element Method)、應力壽命曲線(S-N Curve) 高周疲勞(... | ||||
| 105 | 以修正型能... 以修正型能量密度法評估晶圓級封裝之可靠度 (Reliability Assessment of Wafer Level Package using Modified Energy Based Model) | NTHU NDLTD | 碩 | 1.98 |
晶圓級晶片尺寸封裝(Wafer Level Chip Size Packaging (WLCSP))、溫度循環測試(Thermal Cycling Test)、升降溫速率(ramp rate)、持溫時間(dwell time)、潛變(creep)、Darveaux能量密度法(Darveaux’s model)、修正型能量密度法(Max’s model)(modified energy based model)、Coffin-Manson應變法(Coffin-Manson’s model)、元素網格大小(mesh size) 晶圓級晶片... | ||||
| 105 | 彎曲循環負... 彎曲循環負載下矽質微結構之高週波疲勞壽命預估及負載頻率效應研究 (High cycle fatigue life prediction and investigation of loading frequency effect of Si-based micro structures under bending cyclic loading) | NTHU NDLTD | 碩 | 1.98 |
微結構(Micro structure)、頻率效應(Frequency effect)、高週期疲勞(High cycle fatigue)、壽命預估(Life prediction)、矽質(Silicon) 微結構(M... | ||||
| 105 | 具玻璃基板... 具玻璃基板扇出型晶圓級封裝結構參數分析及可靠度評估 (Reliability Assessment and Parametric Analysis of Fan-out Wafer-Level Packaging with Glass Substrate) | NTHU NDLTD | 碩 | 1.98 |
扇出型封裝(Fan-Out Package)、晶圓級封裝(Wafer Level Package)、有限單元法(Finite Element Method)、可靠度預測(Reliability)、影像感測元件(Optical device) 扇出型封裝... | ||||
| 105 | 以不同潛變... 以不同潛變理論進行電子封裝熱應力模擬之適用有限單元尺寸研究 (Study on feasible finite element size of electrical packaging thermal stress simulation conducting with different creep theory) | NTHU NDLTD | 碩(提早入學) | 2.38 |
晶圓級晶片尺寸封裝(Wafer Level Chip Scale Packaging)、加速溫度循環負載(Thermal Cycling Test)、潛變(Creep)、應力鬆弛現象(Anand Constitutive Model)、Anand模型(Garofalo Hyperbolic Sine Model)、Garofalo雙曲正弦模型(Element Size Control)、Coffin-Manson法(Energy-Based model)、Energy-based模型(Coffin-Manson model)、單元尺寸控制(undefined) 晶圓級晶片... | ||||
| 105 | 針對電子封... 針對電子封裝中SAC錫球潛變破壞之修正型亞蘭德模型可行性研究 (Feasibility Study on Modified Anand model for Failure assessment of SAC Solder Joints in Electronic packages) | NTHU NDLTD | 碩(提早入學) | 2.38 |
晶圓級晶片尺寸封裝(WLCSP)、限單元素模擬法(Primary Creep)、加速熱循環(Accelerated Thermal Cycling)、Modified-Anand模型(Anand Model) 晶圓級晶片... | ||||
| 104 | 先進封裝錫... 先進封裝錫球接點於不同溫度循環負載速率下之可靠度評估 (Reliability Assessment of Advanced Packaging Solder Joints under Different Thermal Cycling Ramp Rates) | NTHU NDLTD | 博 | 無口試日期 |
溫度升降速率(Ramp rate)、潛變(Creep)、應變率(Strain rate)、能量密度壽命方程式(Energy density-based lifetime equation)、加速因子壽命方程式(AF equation)、有限單元分析(Finite element analysis) 溫度升降速... | ||||
| 104 | 以電壓量測... 以電壓量測法評估電容式微機電加速度計之等效機械特性 (Assessment on Effective Mechanical Properties of MEMS Capacitance Type Accelerometer Using Voltage Measurement Technique) | NTHU NDLTD | 碩 | 無口試日期 |
微機電系統(MEMS)、電容式加速度計(Capacitive Accelerometer)、共振頻率(Resonance Frequency)、模態分析(Modal Analysis)、吸合電壓(Pull-in Voltage)、等向性材料(Isotropic Material)、正交性材料(Orthotropic Material)、封裝效應(Packaging Effect)、殘餘應力(Residual Stress) 微機電系統... | ||||
| 104 | 發光二極體... 發光二極體加速老化試驗之溫度與電流加速因子分析 (Current and Temperature Acceleration Factor on Accelerated Aging Test for Light Emitting Diodes) | NTHU NDLTD | 碩 | 無口試日期 |
高功率發光二極體(Light emitting diode (LED))、加速老化壽命試驗(Accelerated aging test)、加速因子(Acceleration factor (AF)) 高功率發光... | ||||
| 104 | 球閘陣列型... 球閘陣列型態封裝之修訂加速因子研究 (Research on Modified Acceleration Factor for BGA Type Package) | NTHU NDLTD | 碩 | 無口試日期 |
球閘陣列型態封裝(Ball Grid Array)、加速因子(Acceleration Factor)、最高溫度(Maximum temperature)、潛變(Creep)、Garofalo Hyperbolic Sine模型(Garofalo Hyperbolic Sine Model)、Coffin-Manson應變法(Coffin-Manson strain based model)、Darveax能量密度法(Darveax energy based model) 球閘陣列型... | ||||
| 103 | 雙邊式功率... 雙邊式功率模組銅凸塊電訊接點之可靠度分析與評估 (Reliability Analysis of Cu Bump Interconnection used in Double-sided Power Module) | NTHU NDLTD | 碩 | 無口試日期 |
雙邊式功率模組(double-sided power module)、功率循環(power cycle)、凸塊接點(bump interconnection)、接點可靠度(reliability of interconnection)、介金屬化合物(intermetallic compounds) 雙邊式功率... | ||||
| 103 | 封裝效應於... 封裝效應於SOI電容式三軸微機電加速度計之探討 (Research on Packaging Effects of Three-axis SOI MEMS Accelerometer) | NTHU NDLTD | 碩 | 無口試日期 |
封裝效應(Package effect)、微機電系統(SOI MEMS)、加速度計(Accelerometer)、共振頻率(Resonant frequency)、殘餘應力(Residual stress)、模態分析(Modal analysis)、製程模擬(Process modeling)、有限單元應用及模擬(FEM Applications and simulation) 封裝效應(... | ||||
| 103 | 潛變行為對... 潛變行為對晶圓級封裝之可靠度影響分析 (Creep Behavior Analysis for the Reliability Assessment on WLCSP) | NTHU NDLTD | 碩 | 無口試日期 |
晶圓級晶片尺寸封裝(Wafer Level Chip Size Packaging (WLCSP))、加速熱循環負載(Accelerated Thermal Cycling Test (ATC))、升降溫速率(ramp rate)、潛變(creep)、應力鬆弛現象(stress relaxation effect)、持溫時間(dwell time)、Anand模型(Anand Constitutive Model)、Garofalo 雙曲正弦模型搭配Chaboche動態硬化模型(Garofalo Hyperbolic Sine Model with Chaboche Kinematic Hardening Model)、Coffin-Manson 應變法(Coffin-Mason strain based model)、Darveaux能量密度法(Darveaux energy based model)、Norris-Landzberg 加速因子(Norris-Landzberg Acceleration Factor Model) 晶圓級晶片... | ||||
| 103 | 以ALE法... 以ALE法應用於LED打線接合製程之模擬分析研究 (Research on Analysis of LED Wire Bonding Process Using Arbitrary Lagrangian-Eulerian Method) | NTHU NDLTD | 碩 | 無口試日期 |
發光二極體(Light emitting diode (LED))、打線接合製程(Wire Bonding Process)、ALE座標描述法(Arbitrary Lagrangian-Eulerian Method)、網格重劃法(Remesh)、平衡網格平滑演算法(Mesh Smoothing Algorithm) 發光二極體... | ||||
| 103 | 高功率發光... 高功率發光二極體之溫度與電流加速老化效應分析 (Study on Temperature and Current Stress Aging Effect for High Power Light Emitting Diodes) | NTHU NDLTD | 碩 | 無口試日期 |
高功率發光二極體(HP-LED)、有限單元熱分析(Finite Element thermal analysis)、加速老化壽命試驗(Accelerated aging test)、阿瑞尼士壽命預估模型(Arrhenius’s equation) 高功率發光... | ||||
| 102 | 使用全域-... 使用全域-局部有限單元法於電力模組功率循環測試之熱傳分析與可靠度評估 (Thermal Analysis and Reliability Assessment of Power Module under Power Cycling Test Using Global- Local Finite Element Method) | NTHU NDLTD | 碩(提早入學) | 無口試日期 |
功率模組(power module)、功率循環試驗(power cycling test)、多點約束有限單元法(multi-point constraints method)、熱-結構直接耦合分析(direct-field coupling thermal-structural analysis)、鋁導線可靠度(the reliability of bonding wire) 功率模組(... | ||||
| 102 | 應變率對封... 應變率對封裝可靠度影響評估 (The Strain Rate Effect on Reliability Assessment of Electronic Packaging) | NTHU NDLTD | 碩 | 無口試日期 |
功率模組、晶圓級晶片尺寸封裝、應變率、熱循環、網格劃分尺寸 功率模組、... | ||||
| 101 | 溫度負載形... 溫度負載形式對功率模組之可靠度影響評估 (Reliability assessment of the temperature profiles effect on the power module) | NTHU NDLTD | 碩 | 無口試日期 |
功率模組(power module)、潛變(creep)、升降溫速率(ramp rate)、持溫時間(dwell time)、Darveaux 壽命預估模型(Darveaux life prediction model)、裂紋長度(crack length)、溫度循環(thermal cycling) 功率模組(... | ||||
| 101 | 溫度效應於... 溫度效應於三維整合晶片掉落可靠度影響之研究 (Investigating the Temperature Effect of Reliability on Integration IC 3D Packaging under Drop Test) | NTHU NDLTD | 碩 | 無口試日期 |
三維晶片封裝(3D IC integration packaging)、掉落測試(drop test)、玻璃轉換溫度(glass transition temperature)、掉落可靠度(drop reliability)、底膠(underfill) 三維晶片封... | ||||
| 101 | 高功率發光... 高功率發光二極體老化試驗之加速因子分析 (Acceleration Factor Analysis of Aging Test for High Power Light Emitting Diodes) | NTHU NDLTD | 碩 | 無口試日期 |
發光二極體(Light emitting diode (LED))、IES LM-80-08(IES LM-80-08)、IES TM-21-11(IES TM-21-11)、加速老化試驗(Accelerated aging test)、加速因子(Acceleration factor (AF)) 發光二極體... | ||||
| 101 | 以ALE與... 以ALE與外顯示時間處理法進行LED打線接合製程之模擬分析 (Analysis of LED Wire Bonding Process Using Arbitrary Lagrangian-Eulerian and Explicit Time Integration Methods) | NTHU NDLTD | 碩 | 無口試日期 |
發光二極體(Light emitting diode)、ALE座標描述法(Arbitrary Lagrangian-Eulerian)、網格重劃分法(Remesh)、有限元素法(Finite element method)、打線接合製程(Wire bonding process) 發光二極體... |